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TO-5

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In electronics, TO-5 (Transistor Outline 5) is a designation for a standardized metal <a href="Semiconductor_package" title="Semiconductor package">semiconductor package</a> used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a series of technical drawings produced by <a href="JEDEC" title="JEDEC">JEDEC</a>.<a href="#cite_note-TO-5_Spec-1">[1]</a> The first commercial silicon transistors, the <a href="2N696" title="2N696">2N696 and 2N697</a> from <a href="Fairchild_Semiconductor" title="Fairchild Semiconductor">Fairchild Semiconductor</a>, came in a TO-5 package.<a href="#cite_note-:0-2">[2]</a>

<div class="mw-heading mw-heading2"><h2 id="Construction_and_orientation">Construction and orientation</h2></div>

The tab is located 45° from pin 1, which is typically the emitter. The typical TO-5 package has a base diameter of 8.9 mm (0.35 in), a cap diameter of 8.1 mm (0.32 in), a cap height of 6.3 mm (0.25 in).<a href="#cite_note-TO-5_Spec-1">[1]</a> The pins are isolated from the package by individual glass-metal seals, or by a single resin potting. Sometimes one pin is connected directly to the metal case.

<div class="mw-heading mw-heading2"><h2 id="Variants">Variants</h2></div>

Several variants of the original TO-5 package have the same cap dimensions but differ in the number and length of the leads (wires). Somewhat incorrectly, TO-5 and <a href="#TO-39">TO-39</a> are often used in manufacturer's literature as synonyms for any package with the cap dimensions of TO-5, regardless of the number of leads, or even for any package with the diameter of TO-5, regardless of the cap height and the number of leads.<a href="#cite_note-3">[3]</a> Compared to TO-5, for the other variants (except <a href="#TO-33">TO-33</a> and <a href="#TO-42">TO-42</a>) the minimum length of the leads was shortened from 38.1 mm (1.50 in) to 12.7 mm (0.50 in) which is sufficient for <a href="Through-hole_technology" title="Through-hole technology">through-hole technology</a> and leads to a cost reduction, whereas the longer leads were needed for <a href="Point-to-point_construction" title="Point-to-point construction">point-to-point construction</a>. Lead lengths of 25.4 mm (1.00 in) and 19.05 mm (0.750 in) are quite common but were not standardized separately by JEDEC. There are variants with between 2 and 12 leads. The leads are arranged in a circle with a diameter of 5.08 mm (0.200 in) (except TO-96, TO-97, TO-100, TO-101). Before the introduction of <a href="Dual_in-line_package" title="Dual in-line package">dual in-line packages</a> in 1965, integrated circuits were packaged mostly in metal can packages such as the TO-5 variants with more than 3 leads.<a href="#cite_note-4">[4]</a>

The TO-39, TO-9, and TO-16 packages have 3 leads and differ in the shortened leads mentioned above from TO-5.<a href="#cite_note-5">[5]</a> Additionally, the TO-9 and TO-16 packages do not have a tab.<a href="#cite_note-6">[6]</a> The TO-42 package is almost identical to the TO-5 package (including the long leads) but has four stand-offs at the bottom of the base that keep the base about 0.5 mm above the circuit board.<a href="#cite_note-7">[7]</a> Possibly the TO-16 and TO-42 designations were not actually used.<a href="#cite_note-:0-2">[2]</a>

The TO-12 and TO-33 packages have 4 leads.<a href="#cite_note-8">[8]</a> TO-33 has 38.1 mm (1.50 in) leads<a href="#cite_note-9">[9]</a> like TO-5 while TO-12 has 12.7 mm (0.50 in) leads. For transistors, the fourth wire is typically connected to the metal case as a means of <a href="Electromagnetic_shielding" title="Electromagnetic shielding">electromagnetic shielding</a> for <a href="Radio_frequency" title="Radio frequency">radio frequency</a> applications.

The TO-75 package has 6 leads (at most one of those may be omitted).<a href="#cite_note-10">[10]</a> The minimum angle between two adjacent leads is 60°.

The TO-76 and TO-77 packages have 8 leads (up to three of those may be omitted).<a href="#cite_note-11">[11]</a> The minimum angle between two adjacent leads is 45°. The TO-77 package differs from the TO-76 package only in that the bottom of a TO-77 package can sit directly on a <a href="Circuit_board" class="mw-redirect" title="Circuit board">circuit board</a> whereas the TO-76 package requires a distance of up to 1.02 mm (0.040 in) between circuit board and package.<a href="#cite_note-12">[12]</a>

The TO-78,<a href="#cite_note-13">[13]</a> TO-79,<a href="#cite_note-14">[14]</a> TO-80,<a href="#cite_note-15">[15]</a> and TO-99<a href="#cite_note-16">[16]</a> packages have 8 leads (up to three of those may be omitted). The minimum angle between two adjacent leads is 45°. These packages differ from other variants in the height of the cap. Instead of 6.3 mm (0.25 in) the cap height is only 4.45 mm (0.175 in) for TO-78 / TO-99, 3.81 mm (0.150 in) for TO-79, and 2.41 mm (0.095 in) for TO-80. The TO-78 package differs from the TO-99 package only in that the bottom of a TO-78 package can sit directly on a <a href="Circuit_board" class="mw-redirect" title="Circuit board">circuit board</a> whereas the TO-99 package requires a distance of up to 1.02 mm (0.040 in) between circuit board and package.

The TO-74 package has 10 leads (at most one of those may be omitted).<a href="#cite_note-17">[17]</a> The minimum angle between two adjacent leads is 36°.

The TO-96,<a href="#cite_note-18">[18]</a> TO-97,<a href="#cite_note-19">[19]</a> and TO-100<a href="#cite_note-20">[20]</a> packages have 10 leads (at most one of those may be omitted). The minimum angle between two adjacent leads is 36°. For these packages the diameter of the circle of leads is increased from 5.08 mm (0.200 in) to 5.84 mm (0.230 in). This allows a slightly increased chip area in a cap of unchanged diameter. TO-96 has the standard cap height of 6.3 mm (0.25 in), while TO-100 and TO-97 have reduced cap heights of 4.45 mm (0.175 in) (like TO-78) and 3.81 mm (0.150 in) (like TO-79), respectively.

The TO-73 package has 12 leads (at most one of those may be omitted).<a href="#cite_note-21">[21]</a> The minimum angle between two adjacent leads is 30°.

The TO-101 package has 12 leads (at most one of those may be omitted).<a href="#cite_note-22">[22]</a> The minimum angle between two adjacent leads is 30°. For this package the diameter of the circle of leads is increased from 5.08 mm (0.200 in) to 5.84 mm (0.230 in). This allows a slightly increased chip area in a cap of unchanged diameter. TO-101 has a reduced cap height of 4.45 mm (0.175 in) (like TO-78).

TO-205 is intended to replace previous definitions of packages with leads arranged in a circle with a diameter of 5.08 mm (0.200 in).<a href="#cite_note-23">[23]</a><a href="#cite_note-jep95-24">[24]</a> The different outlines are now defined as variants of TO-205: TO-5 is renamed to TO-205-AA, TO-12 to TO-205-AB, TO-33 to TO-205-AC, TO-39 to TO-205-AD. A new package with 3 leads and a cap height of 4.32 mm (0.170 in) (similar to TO-78 / TO-99) is added as TO-205-AF.

<div class="mw-heading mw-heading2"><h2 id="National_Standards">National Standards</h2></div>

<th rowspan="2">Standards organization

</th>

<th rowspan="2">Standard

</th>

<th colspan="5">Designation for

</th></tr>

<tr>

<th>TO-5

</th>

<th>TO-12

</th>

<th>TO-33

</th>

<th>TO-39

</th>

<th>TO-77

</th></tr>

<tr>

<td><a href="JEDEC" title="JEDEC">JEDEC</a>

</td>

</td>

<td>TO-205-AA

</td>

<td>TO-205-AB

</td>

<td>TO-205-AC

</td>

<td>TO-205-AD

</td>

<td>—

</td></tr>

<tr>

</td>

</td>

<td>C4/B4A

</td>

<td>C4/B6C

</td>

<td>C4/B6A

</td>

<td>C4/B4C

</td>

<td>C4/B7C

</td></tr>

<tr>

</td>

</td>

<td>5A3

</td>

<td>5C4

</td>

<td>

</td>

<td>5C3

</td>

<td>5C8

</td></tr>

<tr>

<td><a href="EIAJ" class="mw-redirect" title="EIAJ">EIAJ</a> / <a href="JEITA" class="mw-redirect" title="JEITA">JEITA</a>

</td>

</td>

<td>TC5/TB-5A

</td>

<td>TC5/TB-14C

</td>

<td>TC5/TB-14A

</td>

<td>TC5/TB-5C

</td>

<td>TC5/TB-15C

</td></tr>

<tr>

<td><a href="British_Standards" title="British Standards">British Standards</a>

</td>

</td>

<td>SO-3/SB3-3A

</td>

<td>SO-3/SB4-1B

</td>

<td>

</td>

<td>SO-3/SB3-3B

</td>

<td>SO-3/SB8-1B

</td></tr>

<tr>

<td><a href="Gosstandart" title="Gosstandart">Gosstandart</a>

</td>

</td>

<td rowspan="2">—

</td>

</td>

<td rowspan="2">—

</td>

</td>

<td rowspan="2">—

</td></tr>

<tr>

<td><a href="Rosstandart" title="Rosstandart">Rosstandart</a>

</td>

</td></tr>

<tr>

<td rowspan="2"><a href="Kombinat_Mikroelektronik_Erfurt" title="Kombinat Mikroelektronik Erfurt">Kombinat Mikroelektronik Erfurt</a>

</td>

</td>

<td>—

</td>

<td>—

</td>

<td>—

</td>

<td>B3/15-3a

</td>

<td>—

</td></tr>

<tr>

</td>

<td>—

</td>

<td>—

</td>

<td>—

</td>

<td>F1BC3

</td>

<td>—

</td></tr></tbody></table>

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<li id="cite_note-bc-25">^ <a href="#cite_ref-bc_25-0">a</a> <a href="#cite_ref-bc_25-1">b</a> <a href="#cite_ref-bc_25-2">c</a> These standards have separate drawings for the package case and the base.

</li>

<li id="cite_note-31"><a href="#cite_ref-31">^</a> <a href="Russian_language" title="Russian language">Russian</a>: КТ-2-12

</li>

<li id="cite_note-32"><a href="#cite_ref-32">^</a> <a href="Russian_language" title="Russian language">Russian</a>: КТ-2-7

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</ol></div></div>

<div class="mw-heading mw-heading2"><h2 id="References">References</h2></div>

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</style><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20170618142922/https://www.jedec.org/sites/default/files/docs/archive/to/to-005.pdf">"JEDEC TO-5 package specification"</a> (PDF). <a href="JEDEC" title="JEDEC">JEDEC</a>. Archived from <a rel="nofollow" class="external text" href="https://www.jedec.org/sites/default/files/docs/archive/to/to-005.pdf">the original</a> (PDF) on June 18, 2017.</cite>

</li>

<li id="cite_note-:0-2">^ <a href="#cite_ref-:0_2-0">a</a> <a href="#cite_ref-:0_2-1">b</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="http://semiconductormuseum.com/PhotoGallery/PhotoGallery_2N697.htm">"Fairchild 2N697"</a>. Transistor Museum. Retrieved 2021-07-16.</cite>

</li>

<li id="cite_note-3"><a href="#cite_ref-3">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://www.ti.com/lit/an/snoa033/snoa033.pdf">"Metal Can Packages"</a> (PDF). National Semiconductor / Texas Instruments. August 1999. pp. 7–14. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-4"><a href="#cite_ref-4">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://www.computerhistory.org/siliconengine/package-is-the-first-to-accommodate-system-design-considerations/">"1965: Package is the first to accommodate system design considerations"</a>. Computer History Museum. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-5"><a href="#cite_ref-5">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160410012520/http://www.jedec.org/sites/default/files/docs/archive/to/to-039.pdf">"TO-39"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-039.pdf">the original</a> (PDF) on 2016-04-10. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-6"><a href="#cite_ref-6">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160410012409/http://www.jedec.org/sites/default/files/docs/archive/to/to-009.pdf">"TO-9"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-009.pdf">the original</a> (PDF) on 2016-04-10. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-7"><a href="#cite_ref-7">^</a> "...does not meet the minimum criteria ...for registration." <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160405133801/http://www.jedec.org/sites/default/files/docs/archive/to/to-042.pdf">"TO-42"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-042.pdf">the original</a> (PDF) on 2016-04-05. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-8"><a href="#cite_ref-8">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160405133738/http://www.jedec.org/sites/default/files/docs/archive/to/to-012.pdf">"TO-12"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-012.pdf">the original</a> (PDF) on 2016-04-05. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-9"><a href="#cite_ref-9">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160404193725/http://www.jedec.org/sites/default/files/docs/archive/to/to-033.pdf">"TO-33"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-033.pdf">the original</a> (PDF) on 2016-04-04. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-10"><a href="#cite_ref-10">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160405141946/http://www.jedec.org/sites/default/files/docs/archive/to/to-075.pdf">"TO-75"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-075.pdf">the original</a> (PDF) on 2016-04-05. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-11"><a href="#cite_ref-11">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160404203006/http://www.jedec.org/sites/default/files/docs/archive/to/to-076.pdf">"TO-76"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-076.pdf">the original</a> (PDF) on 2016-04-04. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-12"><a href="#cite_ref-12">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160405014716/http://www.jedec.org/sites/default/files/docs/archive/to/to-077.pdf">"TO-77"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-077.pdf">the original</a> (PDF) on 2016-04-05. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-13"><a href="#cite_ref-13">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160405073854/http://www.jedec.org/sites/default/files/docs/archive/to/to-078.pdf">"TO-78"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-078.pdf">the original</a> (PDF) on 2016-04-05. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-14"><a href="#cite_ref-14">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160410045840/http://www.jedec.org/sites/default/files/docs/archive/to/to-079.pdf">"TO-79"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-079.pdf">the original</a> (PDF) on 2016-04-10. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-15"><a href="#cite_ref-15">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160405021054/http://www.jedec.org/sites/default/files/docs/archive/to/to-080.pdf">"TO-80"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-080.pdf">the original</a> (PDF) on 2016-04-05. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-16"><a href="#cite_ref-16">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160410011937/http://www.jedec.org/sites/default/files/docs/archive/to/to-099.pdf">"TO-99"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-099.pdf">the original</a> (PDF) on 2016-04-10. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-17"><a href="#cite_ref-17">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160410042045/http://www.jedec.org/sites/default/files/docs/archive/to/to-074.pdf">"TO-74"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-074.pdf">the original</a> (PDF) on 2016-04-10. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-18"><a href="#cite_ref-18">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160410131547/http://www.jedec.org/sites/default/files/docs/archive/to/to-096.pdf">"TO-96"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-096.pdf">the original</a> (PDF) on 2016-04-10. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-19"><a href="#cite_ref-19">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160405150355/http://www.jedec.org/sites/default/files/docs/archive/to/to-097.pdf">"TO-97"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-097.pdf">the original</a> (PDF) on 2016-04-05. Retrieved 2021-06-21.</cite>

</li>

<li id="cite_note-20"><a href="#cite_ref-20">^</a> <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20160410045719/http://www.jedec.org/sites/default/files/docs/archive/to/to-100.pdf">"TO-100"</a> (PDF). JEDEC. Archived from <a rel="nofollow" class="external text" href="http://www.jedec.org/sites/default/files/docs/archive/to/to-100.pdf">the original</a> (PDF) on 2016-04-10. Retrieved 2021-06-21.</cite>

</li>

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</ol></div></div>

<div class="mw-heading mw-heading2"><h2 id="External_links">External links</h2></div>

<ul><li><a rel="nofollow" class="external text" href="http://eesemi.com/to5.htm">TO-5 package</a> from EESemi.com</li></ul>

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</style><div id="Semiconductor_packages323" style="font-size:114%;margin:0 4em"><a href="Semiconductor_package" title="Semiconductor package">Semiconductor packages</a></div></th></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Single <a href="Diode" title="Diode">diode</a></th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;"><a href="Semiconductor_device" title="Semiconductor device">3...5-pin</a></th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

<li><a href="TO-3" title="TO-3">TO-3</a> (TH / Panel)</li>

<li><a href="TO-66" title="TO-66">TO-66</a> (TH / Panel)</li>

<li><a href="TO-126" title="TO-126">TO-126</a> (TH / Panel)</li>

<li>TO-202 (TH / Panel)</li>

<li><a href="TO-220" title="TO-220">TO-220</a> (TH / Panel)</li>

<li>TO-247 (TH / Panel)</li>

<li>TO-273 (Super-220) (SMT)</li>

<li>TO-274 (Super-247) (SMT)</li>

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Single row</th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Dual row</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

<li><a href="Thin_small_outline_package" title="Thin small outline package">TSOP / HTSOP</a></li>

<li><a href="Thin_shrink_small_outline_package" title="Thin shrink small outline package">TSSOP / HTSSOP</a></li>

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Quad row</th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Grid array</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;"><a href="Wafer_(electronics)" title="Wafer (electronics)">Wafer</a></th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Related topics</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

<ul><li><a href="Electronic_packaging" title="Electronic packaging">Electronic packaging</a></li>

<li><a href="Integrated_circuit_packaging" title="Integrated circuit packaging">Integrated circuit packaging</a></li>

<li><a href="List_of_electronic_component_packaging_types" title="List of electronic component packaging types">List of electronic component packaging types</a></li>

<li><a href="Printed_circuit_board" title="Printed circuit board">Printed circuit board</a></li>

<li><a href="Surface-mount_technology" title="Surface-mount technology">Surface-mount technology</a></li>

<li><a href="Through-hole_technology" title="Through-hole technology">Through-hole technology</a></li></ul>

</div></td></tr><tr><td class="navbox-abovebelow" colspan="2"><div>It is relatively common to find packages that contain other components than their designated ones, such as diodes or <a href="Voltage_regulator" title="Voltage regulator">voltage regulators</a> in transistor packages, etc.</div></td></tr></tbody></table></div></div><div><div class="zim-footer">

This article is issued from <a class="external text" title="Last edited on 2024-11-23" href="https://en.wikipedia.org/wiki/?title=TO-5&oldid=1259149476">Wikipedia</a>. The text is available under <a class="external text" href="https://creativecommons.org/licenses/by-sa/4.0/deed.en">Creative Commons Attribution-Share Alike 4.0</a> unless otherwise noted. Additional terms may apply for the media files.

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